Technology Extension

Mirra Plus enables copper interconnect and low k dielectric planarization with these differentiating features:

• 200mm Titan Contour Polishing Head
  Get full wafer profile control using five independent concentric pressure zones with a low downforce capability to 0.1psi and decreased edge exclusion to 3mm (see figure 1).
  
  
• iScan Thickness Monitor and FullScan Optical Endpoint Systems
  Ensure precise platen 1 endpoint with bulk copper, which allows soft landing and endpoint on platen 2 with minimum dishing and erosion.
  
  
• Distributed Slurry Delivery Arm (DSDA)
  Increase copper removal rate up to 20% (see figure 2) with improved within-wafer non-uniformity up to 10%.
  
  

Figure 1. Titan Contour has the capability to process almost any combination of incoming wafer profiles: center thick, center thin, edge thick, edge thin. Data shows range of profile modifications possible with multizone control.

Figure 2. The distributed slurry delivery arm significantly improves removal rate.