Semicon West 2010 Media Kit

Headline

Applied Materials to Highlight Innovations for Enabling Future Electronic Devices in San Francisco This Week

Solutions for Advanced Metalization

Headline

Applied Materials Celebrates 20-Year Success of Endura System with New Innovations for Cutting-Edge Chip Designs

Multimedia

Video: Endura System Celebrates 20-year Success with Cutting-Edge Innovations
Photo: Applied Endura iLB PVD/ALD (hi-res / lo-res)

Resources

Backgrounder: Metal Gate Technology for Logic Transistors (162KB, PDF)

Through-Silicon Via (TSV) Innovation

Headline

Applied Materials Leads the Way to Enable TSV Interconnects for 3D Chip Stacking

Multimedia

Video: Applied Leads the Way to Enable TSV Interconnects for 3D Chip Stacking
Photo: Applied Producer Avila (hi-res / lo-res)

Resources

Backgrounder: Wafer-Level Packaging and Through-Silicon Via Applications (43KB, PDF)

Latest Conductor Etch Innovation

Headline

Applied Materials Sees Record Adoption of New AdvantEdge Silicon Etch Technology

Multimedia

Video: Applied Centura AdvantEdge Mesa - Angstrom-Level Critical Etch for Conductor Applications
Photo: Applied Centura AdvantEdge Mesa (hi-res / lo-res)

Advanced Service Solutions

Headline

Multimedia

Video: Predictive Scheduling System Boosts Lithography Efficiency
Video: Applied iSYS - The industry's first fully integrated SubFab solution for controlling emissions
Graphic: SmartSched (hi-res / lo-res)
Graphic: SmartFactory (hi-res / lo-res)

Resources

Nanochip Fab Solutions - Automation Software: Strategies to Dive Efficiency and Productivity (2.1MB, PDF)
Predictive Approach Improves Litho Scheduling (300KB, PDF)
SmartFactory - A Uniquely Integrated Solution for Rapidly Emerging Industries (400KB, PDF)
iSYS Product Brochure (1.6MB, PDF)